DC2: Cost-effective and robust EMI detection systems for smart electronic devices using generic PCB structures
Project: Cost-effective and robust EMI detection systems for smart electronic devices using generic PCB structures (WP1)
Host institution: Fraunhofer (Germany)
Supervisor: Marian Lanzrath (Fraunhofer, Germany)
Co-supervisor(s): Heyno Garbe (LUH, Germany), Mohammed Ramdani (ESEO, France), Samuel Hildebrandt (Lumiloop, Germany)
Objectives:
- Investigate the adaptability of PCB structures for EM detection systems within Smart Electronic Devices (SEDs).
- Assess the feasibility of implementing standardized PCB layouts for EM detection systems within SEDs.
- Design, implement and validate an IEMI-sensor integrated onto a PCB.
Expected Results:
- Assessment of the adaptability of PCB structures for EM-detection systems within SEDs.
- Proof of feasibility of implementing standardized PCB layouts for EM disturbance detection.
Planned secondment(s):
- Academic secondment: ESEO, Richard Perdriau, M18-M19, 2M, Integration of detection techniques in PCBs and circuit design principles for EMI analysis
- Industrial secondment: Lumiloop, Samuel Hildebrandt, M22-M23, 2M, Integration of (optical) rf sensors in PCB structure
Enrolment in Doctoral degree: LUH (Germany)