DC2: Cost-effective and robust EMI detection systems for smart electronic devices using generic PCB structures

Project: Cost-effective and robust EMI detection systems for smart electronic devices using generic PCB structures (WP1)

Host institution: Fraunhofer (Germany)

Supervisor: Marian Lanzrath (Fraunhofer, Germany)

Co-supervisor(s): Heyno Garbe (LUH, Germany), Mohammed Ramdani (ESEO, France), Samuel Hildebrandt (Lumiloop, Germany)

Objectives:

  1. Investigate the adaptability of PCB structures for EM detection systems within Smart Electronic Devices (SEDs).
  2. Assess the feasibility of implementing standardized PCB layouts for EM detection systems within SEDs.
  3. Design, implement and validate an IEMI-sensor integrated onto a PCB.

Expected Results:

  1. Assessment of the adaptability of PCB structures for EM-detection systems within SEDs.
  2. Proof of feasibility of implementing standardized PCB layouts for EM disturbance detection.

Planned secondment(s):

  1. Academic secondment: ESEO, Richard Perdriau, M18-M19, 2M, Integration of detection techniques in PCBs and circuit design principles for EMI analysis
  2. Industrial secondment: Lumiloop, Samuel Hildebrandt, M22-M23, 2M, Integration of (optical) rf sensors in PCB structure

Enrolment in Doctoral degree: LUH (Germany)

 

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