DC1: Enhancing EMI detection in integrated circuits taking into account speed, precision, and adaptability

Project: Enhancing EMI detection in integrated circuits taking into account speed, precision, and adaptability (WP1)

Host institution: ESEO (France)

Supervisor: Richard Perdriau (ESEO, France)

Co-supervisor(s): Mohammed Ramdani (ESEO, France), Tim Claeys (KU Leuven, Belgium), Frédéric Lafon (Valeo, France)

Objectives:

  1. Develop integrated building blocks capable of the rapid and accurate detection of harmful EMI within integrated circuit.
  2. Investigate and assess various detection techniques, including digital, analogue, and advanced structures like neural networks, for their effectiveness in EMI detection.
  3. Strike a balance between enhancing structures within off-the-shelf integrated circuits and designing specific detection blocks.

Expected Results:

  1. Test chip incorporating innovative integrated early EMI detection blocks, achieving swift and precise identification of EMI.
  2. Adaptive detection methods customized with a focus on minimizing false positives.

Planned secondment(s):

  1. Academic secondment: KU Leuven, Tim Claeys, M26-M29, 3M, Validating the smart IC detection circuitry at very high frequencies >10GHz.
  2. Industrial secondment: VALEO, Frédéric Lafon, M30-M32, 2M, Application of the smart IC detection circuitry in an automotive environment

Enrolment in Doctoral degree: INSA RENNES (France)

 

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