DC1: Enhancing EMI detection in integrated circuits taking into account speed, precision, and adaptability
Project: Enhancing EMI detection in integrated circuits taking into account speed, precision, and adaptability (WP1)
Host institution: ESEO (France)
Supervisor: Richard Perdriau (ESEO, France)
Co-supervisor(s): Mohammed Ramdani (ESEO, France), Tim Claeys (KU Leuven, Belgium), Frédéric Lafon (Valeo, France)
Objectives:
- Develop integrated building blocks capable of the rapid and accurate detection of harmful EMI within integrated circuit.
- Investigate and assess various detection techniques, including digital, analogue, and advanced structures like neural networks, for their effectiveness in EMI detection.
- Strike a balance between enhancing structures within off-the-shelf integrated circuits and designing specific detection blocks.
Expected Results:
- Test chip incorporating innovative integrated early EMI detection blocks, achieving swift and precise identification of EMI.
- Adaptive detection methods customized with a focus on minimizing false positives.
Planned secondment(s):
- Academic secondment: KU Leuven, Tim Claeys, M26-M29, 3M, Validating the smart IC detection circuitry at very high frequencies >10GHz.
- Industrial secondment: VALEO, Frédéric Lafon, M30-M32, 2M, Application of the smart IC detection circuitry in an automotive environment
Enrolment in Doctoral degree: INSA RENNES (France)